The Engineering Analysis process can involve a number of various efforts. It generally transcends disciplines as well as functional groups which involves breadth and depth of knowledge.
• Ability to operate with multiple technologies |
• Cross-functional expertise |
• Cross-industry expertise |
• Independent unbiased perspective |
• Inter-disciplinary knowledge |
Utilize our expertise to augment the efforts of your technologists, reduce TTM (time to market), evaluate new technologies, identify synergies, analyze potential lines of business.
...............................................................................................................................Inter-disciplinary
• Architecture
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• How hardware and software function together | |||
• How do chips interface to the PC board | |||
• How do PC boards interface to each other | |||
• Identifying the value proposition | |||
• Make versus Buy tradeoff analysis | |||
• What is the hardware versus software implementation tradeoff |
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Multiple technologies
• Boards |
• Chips/semiconductors |
• Digital video (JPEG, MPEG, MJPEG) |
• Fiber-optics |
• Intellectual property (business models, positioning, etc.) |
• Networks |
• RF (radio frequency) |
• Systems |
• Video |
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Functional areas
• Business development |
• Contracts |
• Engineering |
• Management |
• Marketing |
• Operations |
• R & D (research & development) |
• Sales |
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Industries
• Computer |
• Communications (telecom, datacom, cable, wireless) |
• Medical electronics |
• Networking (data communications) |
• PC (personal computer) |
• Semiconductor (microprocessor, interface, network) |
• Test and measurement |
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Disciplines
• Hardware (research, design, development)
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• Software
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• Architecture
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