The Engineering Analysis process can involve a number of various efforts. It generally transcends disciplines as well as functional groups which involves breadth and depth of knowledge.
| • Ability to operate with multiple technologies |
| • Cross-functional expertise |
| • Cross-industry expertise |
| • Independent unbiased perspective |
| • Inter-disciplinary knowledge |
Utilize our expertise to augment the efforts of your technologists, reduce TTM (time to market), evaluate new technologies, identify synergies, analyze potential lines of business.
...............................................................................................................................Inter-disciplinary
• Architecture
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| • How hardware and software function together | |||
| • How do chips interface to the PC board | |||
| • How do PC boards interface to each other | |||
| • Identifying the value proposition | |||
| • Make versus Buy tradeoff analysis | |||
| • What is the hardware versus software implementation tradeoff |
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Multiple technologies
| • Boards |
| • Chips/semiconductors |
| • Digital video (JPEG, MPEG, MJPEG) |
| • Fiber-optics |
| • Intellectual property (business models, positioning, etc.) |
| • Networks |
| • RF (radio frequency) |
| • Systems |
| • Video |
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Functional areas
| • Business development |
| • Contracts |
| • Engineering |
| • Management |
| • Marketing |
| • Operations |
| • R & D (research & development) |
| • Sales |
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Industries
| • Computer |
| • Communications (telecom, datacom, cable, wireless) |
| • Medical electronics |
| • Networking (data communications) |
| • PC (personal computer) |
| • Semiconductor (microprocessor, interface, network) |
| • Test and measurement |
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Disciplines
• Hardware (research, design, development)
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• Software
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• Architecture
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